Cite
MLA Citation
Jau-Shiung Fang et al.. “Strengthening the Electromigration Resistance of Nanoscaled Copper Lines by (3-aminopropyl)trimethoxysilane Self-Assembled Monolayer.” ECS journal of solid state science and technology, vol. 10, 2021, p. . http://access.bl.uk/ark:/81055/vdc_100139922076.0x000001