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APA Citation
Zhang, X., Cao, L., Ryan, V., Ho, P. S., Taylor, B., Witt, C., & Labelle, C. (2015). co Liner Impact on Microstructure of Cu Interconnects. ECS journal of solid state science and technology, 4, N3177–N3179. http://access.bl.uk/ark:/81055/vdc_100133936598.0x00001e