Characterization of Parylene C as protective layer on micro-piezoelectric printheads. (December 2015)

• Record Type: Journal Article
• Authors: Lu, Bolin; Yin, Zhifu; Zou, Helin; Zhi, Lisha; Feng, Jianbo
• Is Part Of: Materials science in semiconductor processing. Volume 40(2015:Dec.)
• Page Start: 811
• Page End: 816
• Publication Date: 2015-12
• Subjects: Parylene C -- Piezoelectric inkjet printhead -- Patterning etching -- Adhesive strength; Semiconductors -- Periodicals; Integrated circuits -- Materials -- Periodicals; Semiconducteurs -- Périodiques; Circuits intégrés -- Matériaux -- Périodiques; Electronic journals; 621.38152
• DOI: 10.1016/j.mssp.2015.07.037
• Languages: English
• ISSNs: 1369-8001

Abstract

Abstract: To prevent corrosion of PZT (Lead zirconate titanate) and electrodes in printheads as they are exposed to ink, Parylene C was selected as the protective layer. The deposition thickness, patterning method, and TGA (thermogravimetric analysis) of Parylene C, as well as its adhesive strength on the substrate and its aging property were studied experimentally. The results of the experiments showed that when the deposition thickness of Parylene C was 450 nm, it fully met the voltage-tolerance requirement, with a reduction in vibration displacement of only 12.89%. To pattern the Parylene C, the oxygen plasma etching method was employed, and the dependence of the etch rate on chamber power and chamber pressure were investigated. TGA experiments with Parylene C indicate that it can withstand the working temperature of a wire-bonding process. Pretreating the substrate with silane coupling agent improved the adhesive strength between Parylene C and the substrate significantly. The dielectric constant of Parylene C was reduced only 10% after 23 days in ink, which indicates the excellent aging resistance of Parylene C.