Reliability of pressure-free Cu nanoparticle joints for power electronic devices. (September 2019)

• Record Type: Journal Article
• Authors: Yamada, Y.; Hasegawa, K.; Ikeda, Y.; Kasagi, Y.; Katagiri, K.; Katou, H.; Watanabe, H.; Takenaka, A.; Nagata, H.; Sekine, N.; Sano, Y.
• Is Part Of: Microelectronics and reliability. Volume 100/101(2019)
• Publication Date: 2019-09
• Subjects: Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2019.06.008
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Novel pressure-free Cu nanoparticle joints for power electronic devices were fabricated, and their reliability was investigated. Si heater chips were bonded to Cu-65Mo baseplates without applied pressure in a N2 atmosphere. The increase in thermal resistance was found to be less than 30% after 1000 thermal cycles of −40/150 °C and −40/200 °C. Samples with Ag- or Cu-coated baseplates showed no deterioration following 3000 power cycles of 65/250 °C. In contrast, samples with baseplates coated with Au or Ni exhibited an increase in thermal resistance in power cycle tests of 65/200 °C and 65/250 °C.