Effective and combined stressors from multi-dimensional mission profiles for semiconductor reliability. (September 2019)

• Record Type: Journal Article
• Authors: Hirler, A.; Alsioufy, A.; Biba, J.; Lehndorff, T.; Lochner, H.; Simon, S.; Sulima, T.; Thomas, W.; Hansch, W.
• Is Part Of: Microelectronics and reliability. Volume 100/101(2019)
• Publication Date: 2019-09
• Subjects: Automotive electronics -- Mission profile -- Semiconductor reliability -- Interdependent stressors -- Effective stress; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2019.06.015
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: As mission profiles start to become an essential part of reliability requirements and qualification in the automotive industry, processing multi-dimensional mission profiles with combined stressors requires special attention. We present a method to reduce mission profiles to effective and resulting acceleration factors as a means of dealing with mission profiles for reliability testing. This is elaborated on the first reported iterative step-stress TDDB failure measurement with coupled temperature and voltage stresses. Furthermore, the impact of interdependent stressors on reliability predictions, testing, and qualification is demonstrated with two-dimensional real-world mission profiles for OLED vehicle lighting and a temperature and relative humidity accelerated failure mechanism.