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APA Citation
Campos‐Zatarain, A., Hinton, J., Mirgkizoudi, M., Li, J., Harris, R., Kay, R. W., & Flynn, D. (2019). extreme environment interconnects and packaging for power electronics. Journal of engineering, 2019(17), 4226–4230. http://access.bl.uk/ark:/81055/vdc_100124796050.0x00000f