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Liang, C., & Lin, K. (2018). the amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration. Scripta materialia, , 58–62. http://access.bl.uk/ark:/81055/vdc_100066538801.0x000023
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Liang, C., & Lin, K. (2018). the amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration. Scripta materialia, , 58–62. http://access.bl.uk/ark:/81055/vdc_100066538801.0x000023