Cite
APA Citation
Tang, W., Jing, B., Huang, Y., Sheng, Z., & Jiao, X. (2016). multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions. Chinese journal of electronics, 25(4), 779–785. http://access.bl.uk/ark:/81055/vdc_100124378044.0x000047