Cite
HARVARD Citation
Tang, W. et al. (2016). Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions. Chinese journal of electronics. 25 (4), pp. 779-785. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Tang, W. et al. (2016). Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions. Chinese journal of electronics. 25 (4), pp. 779-785. [Online].