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APA Citation
Zhang, D., Thangaraju, S., Smith, D., Kamineni, H., Klewer, C., Scholefield, M., Lei, M., Vikram, A., Lim, V., Kim, W., & Alapati, R. (2014). bMD impact on silicon fin defect at TSV bottom. Electronics letters, 50(13), 954–956. http://access.bl.uk/ark:/81055/vdc_100124823183.0x000039