FEM model calibration for simulation aided thermal design. (March 2021)

• Record Type: Journal Article
• Authors: Cioban, R.; Szőke, Sz.; Zaharie-B, D.; Kórádi, Z.; Leordean, C.; Simon, S.
• Is Part Of: Microelectronics and reliability. Volume 118(2021)
• Publication Date: 2021-03
• Subjects: Thermal models -- Optimization -- FEM -- Thermal impedance; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2021.114042
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Thermal management is a crucial aspect of electronic assemblies and simulations are playing an important role in decision making during the design phase. For an electronic control unit (ECU), the main heat generating sources are the electronic components soldered on the printed circuit board (PCB). Creating high quality thermal models for the associated components, required in the assembly level simulations, is an ongoing challenge in many industries. While there are well-established measuring methods of the thermal response of a component, mirroring this response in a virtual representation is still challenging. The most common approach is by using structure function transformations of thermal impedance (Zth ) curves and identifying corresponding thermal resistance and capacitance for each layer in a component. Although well-known and reliable, this approach involves a time-consuming manual, iterative approach. An alternative approach, using optimization software, which directly compares Zth curves and adjusts the properties of the model is studied and compared to the iterative approach. These methods are presented for the FEM modelling of a MOSFET in D2PAK (TO-263) package, highlighting the advantages of using direct Zth comparison and optimization in an automated manner. Highlights: Characterization of a MOSFET in D2Pak (TO-263) package Methodology for Finite Element Method model derivation based on thermal impedance measurements Calibration of material properties using structure functions Automated calibration using optimization software and direct comparison of thermal impedance curves