Cite
MLA Citation
K. Schjølberg-Henriksen et al.. “Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints.” ECS journal of solid state science and technology, vol. 4, 2015, pp. P265–P271. http://access.bl.uk/ark:/81055/vdc_100116179813.0x000005