Selective etching of p-GaN over Al0.25Ga0.75N in Cl2/Ar/O2 ICP plasma for fabrication of normally-off GaN HEMTs. (February 2021)
- Record Type:
- Journal Article
- Title:
- Selective etching of p-GaN over Al0.25Ga0.75N in Cl2/Ar/O2 ICP plasma for fabrication of normally-off GaN HEMTs. (February 2021)
- Main Title:
- Selective etching of p-GaN over Al0.25Ga0.75N in Cl2/Ar/O2 ICP plasma for fabrication of normally-off GaN HEMTs
- Authors:
- Taube, Andrzej
Kamiński, Maciej
Ekielski, Marek
Kruszka, Renata
Jankowska-Śliwińska, Joanna
Michałowski, Paweł P.
Zdunek, Joanna
Szerling, Anna - Abstract:
- Abstract: The article presents the results of development of selective etching of p-GaN over Al0.25 Ga0.75 N in Cl2 /Ar/O2 ICP plasma for fabrication of normally-off p-GaN gate GaN HEMTs using a laser reflectometry system for precise control of the etched material thickness. By optimizing etching process parameters such as oxygen flow, ICP power and chamber pressure, high etching selectivity of p-GaN over Al0.25 Ga0.75 N were obtained, with values up to 56:1. High etching selectivity and the control of etch rates of p-GaN and Al0.25 Ga0.75 N layers withing a wide range by changing the ICP process parameters enabled application of developed etching processes in the technology of fabrication of normally-off AlGaN/GaN HEMTs with a p-GaN gate. High threshold voltage of around 1.6 V and current densities up to 400 mA/mm were obtained. Electrical measurements have shown that the shortest 1 min Al0.25 Ga0.75 N overetch time after selective etching of the p-GaN layer results in best electrical parameters of fabricated devices. Graphical abstract: Image 1 Highlights: Results of development of selective etching of p-GaN over Al0.25 Ga0.75 N process using Cl2 /Ar/O2 ICP plasma were presented. High etching selectivity of p-GaN over Al0.25 Ga0.75 N enabled fabrication of normally-off AlGaN/GaN HEMTs. High VTH ~1.6 V, IDS up to 400 mA/mm, Ion /Ioff > 6x10 8 A/A, along with nearly ideal SS value of 63 mV/dec at RT were obtained.
- Is Part Of:
- Materials science in semiconductor processing. Volume 122(2021)
- Journal:
- Materials science in semiconductor processing
- Issue:
- Volume 122(2021)
- Issue Display:
- Volume 122, Issue 2021 (2021)
- Year:
- 2021
- Volume:
- 122
- Issue:
- 2021
- Issue Sort Value:
- 2021-0122-2021-0000
- Page Start:
- Page End:
- Publication Date:
- 2021-02
- Subjects:
- dry etching -- Normally-off HEMT -- p-GaN -- ICP -- Selectivity
Semiconductors -- Periodicals
Integrated circuits -- Materials -- Periodicals
Semiconducteurs -- Périodiques
Circuits intégrés -- Matériaux -- Périodiques
Electronic journals
621.38152 - Journal URLs:
- http://www.sciencedirect.com/science/journal/latest/13698001 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.mssp.2020.105450 ↗
- Languages:
- English
- ISSNs:
- 1369-8001
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5396.440600
British Library DSC - BLDSS-3PM
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- 15181.xml