Cite
APA Citation
Papadopoulos, C., Villiger, T., Steiner, S., Prinz, J., Morabito, C., Cammarata, M., Rodriguez, A., Kwon, J., Geilenkeuser, R., Breuer, D., Kuechenmeister, F., Dienelt, J., Urban, J., Kabus, H., & Krinke, J. (2020). gold wire bond study for automotive application. Microelectronics and reliability, 114, . http://access.bl.uk/ark:/81055/vdc_100114049722.0x00005d