Cite
HARVARD Citation
Gu, W. et al. (2020). Effect of substrate nano-SiO2 hybridization on edge stress distribution of two-dimensional horseshoe-shaped interconnect under thermal load. Japanese journal of applied physics. p. . [Online].
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Gu, W. et al. (2020). Effect of substrate nano-SiO2 hybridization on edge stress distribution of two-dimensional horseshoe-shaped interconnect under thermal load. Japanese journal of applied physics. p. . [Online].