Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study. Issue 1 (3rd February 2020)

• Record Type: Journal Article
• Authors: Asghar, Rafiq; Rehman, Faisal; Aman, Ali; Iqbal, Kashif; Nawaz, Agha Ali
• Is Part Of: Soldering & surface mount technology. Volume 32:Issue 1(2020)
• Page Start: 1
• Page End: 9
• Publication Date: 2020-02-03
• Subjects: Statistical analysis -- Printed circuit board (PCB) -- Solder paste printing -- Portable electronics -- SMA process defects; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-05-2019-0019
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: The purpose of this paper is to investigate and minimize the printing-related defects in the surface mount assembly (SMA) process. Design/methodology/approach: This paper uses an experimental approach to explore process parameter and printing defects during the SMA process. Increasing printing performance, various practices of solder paste (Ag3.0/Cu0.5/Sn) storage and handling are suggested. Lopsided paste problem is studied by varying squeegee pressure and the results are presented. Unfilled pads problems are observed for ball grid array (BGA) and quad flat package (QFP) which is mitigated by proper force tuning. In this paper, a comparative study is conducted which evaluates the manifestation of printing offset due to low-grade stencil. The input/output (I/O) boards were oxidized when the relative humidity was maintained beyond 70 per cent for more than 8 h. This pad oxidation problem is overcome by proper printed circuit board (PCB) handling procedures. When the unoptimized line is used, the paste wedged in the stencil and influences the performance of the screen printer, for this reason, an optimized line is proposed that minimize the printing defects. Findings: The key findings are as follows: in the SMA process, printing quality is directly associated with solder paste quality. Experimentally, it is observed that a considerable variance in solder deposition occurred when the front and rear squeegee have different configurations. High-grade and unsoiled stencil results in superior paste deposition and less distinction. Insufficient solder paste and bridge problems also occur in printing when PCB pads are oxidized. Optimized line resolves solder paste clog issues, associated with stencil's aperture. The cooling arrangement on the conveyor, after reflow, explicates hot jig problem. Control environmental conditions minimized static charges and printing defects. Originality/value: The preceding studies emphasis mostly on the squeegee pressure, while other important parameters are not completely investigated. Moreover, it is very imperative to concurrently measure all parameters while varying the environmental conditions. This study highlights and provides an experimental approach to various PCB printing defects, and a comparative study has been conducted that concurrently measure all process parameters.