Characterization and design optimization of heterojunction photodiodes comprising n-type ultrananocrystalline diamond/hydrogenated amorphous carbon composite and p-type Si. (1st November 2018)
- Record Type:
- Journal Article
- Title:
- Characterization and design optimization of heterojunction photodiodes comprising n-type ultrananocrystalline diamond/hydrogenated amorphous carbon composite and p-type Si. (1st November 2018)
- Main Title:
- Characterization and design optimization of heterojunction photodiodes comprising n-type ultrananocrystalline diamond/hydrogenated amorphous carbon composite and p-type Si
- Authors:
- Shaban, Mahmoud
Zkria, Abdelrahman
Yoshitake, Tsuyoshi - Abstract:
- Abstract: In this paper, we characterize and optimize design of a candidate ultraviolet photodiode based on nitrogen-doped ultrananocrystalline diamond hydrogenated amorphous carbon (UNCD/a-C:H) composite films grown on crystalline-Si substrates by coaxial arc plasma deposition. A comprehensive study including growth, fabrication, characterization, and modeling of the photodetector is presented here. The current-voltage characteristics of the device were reproduced and their critical parameters were extracted from a good matching between experimental and simulation results. A midgap acceptor-like defect state density of ~ 5 × 10 17 cm −3 eV −1 was found to be the dominant defect in the UNCD/a-C:H film, in addition to an interface defect density of ~ 3 × 10 13 cm −2 eV −1 at the interface of the UNCD/a-C:H film and the Si substrate. Experimental and simulation results showed that introducing an intrinsic UNCD/a-C:H layer in a pin heterostructure would significantly reduce the device leakage current and consequently improve its performance as an ultraviolet photodiode. Unoptimized fabricated devices exhibited a room temperature photoresponsivity of 135 mA/W measured under illumination of ultraviolet monochromatic light with a wavelength of 254 nm. The key parameters for optimized design of the device were extracted and investigated in details.
- Is Part Of:
- Materials science in semiconductor processing. Volume 86(2018)
- Journal:
- Materials science in semiconductor processing
- Issue:
- Volume 86(2018)
- Issue Display:
- Volume 86, Issue 2018 (2018)
- Year:
- 2018
- Volume:
- 86
- Issue:
- 2018
- Issue Sort Value:
- 2018-0086-2018-0000
- Page Start:
- 115
- Page End:
- 121
- Publication Date:
- 2018-11-01
- Subjects:
- Ultrananocrystalline diamond -- Coaxial arc plasma deposition -- Heterojunction photodiodes -- Leakage current -- Defect states -- UV photodetection
Semiconductors -- Periodicals
Integrated circuits -- Materials -- Periodicals
Semiconducteurs -- Périodiques
Circuits intégrés -- Matériaux -- Périodiques
Electronic journals
621.38152 - Journal URLs:
- http://www.sciencedirect.com/science/journal/latest/13698001 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.mssp.2018.06.028 ↗
- Languages:
- English
- ISSNs:
- 1369-8001
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5396.440600
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 14213.xml