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APA Citation
Miyajima, H., Watanabe, K., Ishikawa, K., Sekine, M., & Hori, M. (2019). adhesion enhancement and amine reduction using film redeposited at the interface of a stack of plasma-enhanced CVD dielectrics for Cu/low-k interconnects. Japanese journal of applied physics, 58, . http://access.bl.uk/ark:/81055/vdc_100108527641.0x000063