Cite
APA Citation
Chen, Y., Shu, Z., Feng, Z., Kong, L., Liu, Y., & Duan, H. (2020). reliable Patterning, Transfer Printing and Post‐Assembly of Multiscale Adhesion‐Free Metallic Structures for Nanogap Device Applications. Advanced functional materials, 30, n/a. http://access.bl.uk/ark:/81055/vdc_100106112159.0x000019