Cite
HARVARD Citation
Chen, Y. et al. (2020). Reliable Patterning, Transfer Printing and Post‐Assembly of Multiscale Adhesion‐Free Metallic Structures for Nanogap Device Applications. Advanced functional materials. p. n/a. [Online].
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Chen, Y. et al. (2020). Reliable Patterning, Transfer Printing and Post‐Assembly of Multiscale Adhesion‐Free Metallic Structures for Nanogap Device Applications. Advanced functional materials. p. n/a. [Online].