A metal-free additive texturization method used for diamond-wire-sawn multi-crystalline silicon wafers. (1st November 2020)
- Record Type:
- Journal Article
- Title:
- A metal-free additive texturization method used for diamond-wire-sawn multi-crystalline silicon wafers. (1st November 2020)
- Main Title:
- A metal-free additive texturization method used for diamond-wire-sawn multi-crystalline silicon wafers
- Authors:
- Li, Likai
Jin, Hao
Wang, Qi
Yang, Deren
Wang, Lei - Abstract:
- Abstract: Diamond-wire-sawn (DWS) technique has been widely applied in PV industry. However, this technique still has a big challenge when it is used for multi-crystalline silicon (mc-Si) because its reflectivity of DWS mc-Si etched by the conventional acid etching solution (HF/HNO3 /H2 O system) is quite higher. This paper proposes a metal-free additive texturization method, in which polyethylene glycol (PEG) is added to the HF/HNO3 /H2 O system to reduce the reaction rate of silicon wafers and improve the wettability of the etching liquid and the surface of mc-Si wafers. The etching points will gradually turn into nanopores instead of worm-like structures due to low reaction rates. Those nanopores form a gradually changed refractive index between silicon and air, which immensely reduces the surface reflectivity of mc-Si wafers. The mc-Si wafers processed in the experiment have an average surface reflectivity of about 16.9% in the wavelength range of 300–1100 nm, which is generally lower than the mc-Si wafers etched by the conventional acid etching process. This technical route has been applied to fabricate the 156 mm × 156 mm DWS mc-Si solar cells, and finally, the conversion efficiency of 19.39% has been obtained. Moreover, this approach matches well with the current PV industrial processes, showing a promising prospect.
- Is Part Of:
- Materials science in semiconductor processing. Volume 118(2020)
- Journal:
- Materials science in semiconductor processing
- Issue:
- Volume 118(2020)
- Issue Display:
- Volume 118, Issue 2020 (2020)
- Year:
- 2020
- Volume:
- 118
- Issue:
- 2020
- Issue Sort Value:
- 2020-0118-2020-0000
- Page Start:
- Page End:
- Publication Date:
- 2020-11-01
- Subjects:
- Silicon -- Diamond-wire-sawn -- Texturization -- Metal-free additive -- Nanostructure -- Solar cell
Semiconductors -- Periodicals
Integrated circuits -- Materials -- Periodicals
Semiconducteurs -- Périodiques
Circuits intégrés -- Matériaux -- Périodiques
Electronic journals
621.38152 - Journal URLs:
- http://www.sciencedirect.com/science/journal/latest/13698001 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.mssp.2020.105187 ↗
- Languages:
- English
- ISSNs:
- 1369-8001
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5396.440600
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
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