High quality GaAs epitaxially grown on Si(001) substrate through AlAs nucleation and thermal cycle annealing. (April 2020)

• Record Type: Journal Article
• Authors: Ko, Young-Ho; Kim, Kap-Joong; Baek, Ju Hee; Lee, Seo Young; Kim, Duk-Jun; Kim, Jong-Hoi; Guim, Hwanuk; Han, Won Seok
• Is Part Of: Solid-state electronics. Volume 166(2020)
• Publication Date: 2020-04
• Subjects: Silicon laser -- III-V on Si -- Monolithic integration -- Dislocation density -- AlAs nucleation -- Thermal cycle annealing; Semiconductors -- Periodicals; Semiconducteurs -- Périodiques; 621.38152
• DOI: 10.1016/j.sse.2019.107763
• Languages: English
• ISSNs: 0038-1101

Abstract

Highlights: High quality GaAs was directly grown on Si(001) substrate through the AlAs nucleation and TCA methods. Threading dislocation density was quantitatively studied through the ECCI measurement. Optimal thickness of AlAs nucleation for GaAs on Si was determined as 1.68 nm. GaAs on Si(001) was obtained with a TD density of 5.45 × 10 7 cm −2 and thin buffer thickness of 1.5 μm. Abstract: High quality GaAs was epitaxially grown on silicon(001) substrate through a hybrid technique of metalorganic chemical vapor deposition. The hybrid technique was comprised of AlAs nucleation and thermal cycle annealing to take advantages of both methods. The AlAs nucleation improved the surface roughness of GaAs buffer and the thermal cycle annealing reduced the threading dislocation (TD) density of GaAs buffer with small thickness. The GaAs buffer was grown with two-step growth with changing growth temperature and thermal cycle annealing processes. The optimal thickness of AlAs nucleation was determined to be 1.68 nm through systematic study with a series of buffer samples with different AlAs thicknesses. The TD density and surface roughness of GaAs buffer was quantitatively studied through electron channeling contrast imaging and atomic force microscopy, respectively. The growth temperature of GaAs buffer was also optimized to minimize the TD density. High quality GaAs buffer on Si(001) was obtained with a TD density 5.45 × 10 7 cm −2 with smooth surfaces. The total thickness of the buffer was approximately as thin as 1.5 μm. This study demonstrated a solution for silicon-based laser diodes to fulfill the monolithic integration of III-V on a Si platform.