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APA Citation
Aamir, M., Muhammad, R., Tolouei-Rad, M., Giasin, K., & Silberschmidt, V. V. (2020). a review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics. Soldering & surface mount technology, 32(2), 115–126. http://access.bl.uk/ark:/81055/vdc_100102295826.0x000021