Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems. Issue 1 (3rd February 2020)

• Record Type: Journal Article
• Authors: Erer, Ahmet Mustafa; Oguz, Serkan
• Is Part Of: Soldering & surface mount technology. Volume 32:Issue 1(2020)
• Page Start: 19
• Page End: 23
• Publication Date: 2020-02-03
• Subjects: Contact angle -- Wettability -- IMC's -- Pb-free solder alloy; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-08-2018-0028
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach: In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings: In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35, 34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value: This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.