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APA Citation
Mula, S., Han, T., Heiser, T., Lévêque, P., Leclerc, N., Srivastava, A. P., Ruiz‐Carretero, A., & Ulrich, G. (2019). hydrogen Bonding as a Supramolecular Tool for Robust OFET Devices. Chemistry, 25(35), 8304–8312. http://access.bl.uk/ark:/81055/vdc_100101398512.0x00002c