Cite
HARVARD Citation
Mathew, V. et al. (2018). Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection. Thermal science and engineering progress. pp. 221-229. [Online].
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Mathew, V. et al. (2018). Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection. Thermal science and engineering progress. pp. 221-229. [Online].