Cite
APA Citation
Chang, Y., Cheng, Y., Helfen, L., Xu, F., Tian, T., Scheel, M., Di Michiel, M., Chen, C., Tu, K., & Baumbach, T. (2017). electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation. Scientific reports, 7(1), 1–16. http://access.bl.uk/ark:/81055/vdc_100099746088.0x00004b