Cite
HARVARD Citation
Chang, Y. et al. (2017). Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation. Scientific reports. 7 (1), pp. 1-16. [Online].
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Chang, Y. et al. (2017). Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation. Scientific reports. 7 (1), pp. 1-16. [Online].