Cite
APA Citation
Xiang, J., Wang, C., Chen, Y., Xia, F., He, W., Mao, H., Zhou, J., Chen, Q., & Jin, X. (2019). numerical simulation and experiments to improve throwing power for practical PCB through-holes plating. Circuit world, 45(4), 221–230. http://access.bl.uk/ark:/81055/vdc_100093253193.0x000013