Cite
MLA Citation
Mengjiao Guo et al.. “Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding.” Soldering & surface mount technology, vol. 31, no. 4, 2019, pp. 227–232. http://access.bl.uk/ark:/81055/vdc_100089558812.0x000034