A fast and flexible HW/SW co-processing framework for Time-of-Flight 3D imaging. (February 2018)
- Record Type:
- Journal Article
- Title:
- A fast and flexible HW/SW co-processing framework for Time-of-Flight 3D imaging. (February 2018)
- Main Title:
- A fast and flexible HW/SW co-processing framework for Time-of-Flight 3D imaging
- Authors:
- Druml, Norbert
Ehrenhoefer, Christoph
Bell, Walter
Gailer, Christian
Plank, Hannes
Herndl, Thomas
Holweg, Gerald - Abstract:
- Abstract: Time-of-Flight 3D imaging, using the indirect measuring method that employs photonic mixing devices, increases in popularity. This is due to the recent availability of accurate and miniaturized Time-of-Flight cameras that can be integrated into small embedded devices. However, providing a system comprising a camera and hardware-accelerated processing, which is useable for various application types with diametrically opposed use-case requirements, is not trivial. Here we introduce a fast and flexible hardware/software co-processing framework for Time-of-Flight 3D imaging, which can be used for various kinds of use-case applications. This is achieved in particular by providing fine-grained hardware-acceleration for Time-of-Flight algorithms and computer vision applications. Furthermore, this hardware/software framework enables and features state-of-the-art multi-core, mixed-criticality, and real-time concepts, which is essential for critical applications in the automotive and industrial domains. We demonstrate the feasible implementation and integration of the framework by means of a mixed-critical automotive system demonstrator. This demonstrator enables various types of use-case scenarios, such as gesture recognition or indoor navigation, by employing the AURIX automotive processor from Infineon Technologies and the Xilinx Zynq platform. For instance, if a typical gesture recognition use-case is addressed, the framework is capable to provide high-quality depthAbstract: Time-of-Flight 3D imaging, using the indirect measuring method that employs photonic mixing devices, increases in popularity. This is due to the recent availability of accurate and miniaturized Time-of-Flight cameras that can be integrated into small embedded devices. However, providing a system comprising a camera and hardware-accelerated processing, which is useable for various application types with diametrically opposed use-case requirements, is not trivial. Here we introduce a fast and flexible hardware/software co-processing framework for Time-of-Flight 3D imaging, which can be used for various kinds of use-case applications. This is achieved in particular by providing fine-grained hardware-acceleration for Time-of-Flight algorithms and computer vision applications. Furthermore, this hardware/software framework enables and features state-of-the-art multi-core, mixed-criticality, and real-time concepts, which is essential for critical applications in the automotive and industrial domains. We demonstrate the feasible implementation and integration of the framework by means of a mixed-critical automotive system demonstrator. This demonstrator enables various types of use-case scenarios, such as gesture recognition or indoor navigation, by employing the AURIX automotive processor from Infineon Technologies and the Xilinx Zynq platform. For instance, if a typical gesture recognition use-case is addressed, the framework is capable to provide high-quality depth images and 3D-point cloud data with nearly 100 FPS and introduces an average calculation error of only 0.08 mm. Most importantly, a high level of flexibility in software and hardware is preserved in order to support other use-case scenarios at the same time. Highlights: It introduces a novel flexible hardware/software framework for Time-of-Flight 3D image processing. It shows the feasible realization of the flexible Time-of-Flight processing concept by means of a demonstrator targeting mixed-critical applications. It provides detailed evaluation results concerning various performance parameters and utilization of resources. … (more)
- Is Part Of:
- Microelectronics and reliability. Volume 81(2018)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 81(2018)
- Issue Display:
- Volume 81, Issue 2018 (2018)
- Year:
- 2018
- Volume:
- 81
- Issue:
- 2018
- Issue Sort Value:
- 2018-0081-2018-0000
- Page Start:
- 64
- Page End:
- 76
- Publication Date:
- 2018-02
- Subjects:
- Time-of-Flight 3D imaging -- Hardware/software co-design -- FPGA
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2017.12.004 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 11329.xml