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APA Citation
Cai, H., Yan, J., Ma, S., Luo, R., Xia, Y., Li, J., Hu, L., He, S., Tang, Z., Jin, Y., Wang, W., & Chen, J. (n.d.). design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration. Journal of micromechanics and microengineering, 29, . http://access.bl.uk/ark:/81055/vdc_100087547061.0x000056