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APA Citation
Lee, C., Liang, Y. S., Ng, D. K., Yang, Y., Hnin, Y. Y. K., & Wang, Q. (2015). study of ultrathin SiO2 Interlayer wafer bonding for heterogeneous III–V/Si photonic integration. Materials research express, 2, . http://access.bl.uk/ark:/81055/vdc_100087641339.0x000007