Implementation of direct Chip junction temperature measurement in high power IGBT module in operation — Railway traction converter. (September 2018)

• Record Type: Journal Article
• Authors: Piton, M.; Chauchat, B.; Servière, J.F.
• Is Part Of: Microelectronics and reliability. Volume 88/90(2018)
• Page Start: 1305
• Page End: 1310
• Publication Date: 2018-09
• Subjects: Railway traction -- Temperature measurements -- Semi-conductor power devices; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2018.06.114
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Reliability and lifetime of high power IGBT multichip modules used in railway traction converters is key for traction manufacturers to meet operators requirements. High power IGBT multichip modules used today in railway traction are (sub) systems containing a (large) number of paralleled chips. Temperature distribution between paralleled chips in the module may induce predominant effects on performances and operational reliability. This paper presents an experimental set-up based on optical fibers to measure individual chip temperatures of a 6500 V – 750 A IGBT module during converter operation in real conditions of power and voltage. This set-up was used to study chip temperature distribution within high power IGBT multichip modules during different phases of converter operation and cooling conditions. It is also used to evaluate and validate different approaches of condition and health monitoring advanced functions based on indirect temperature measurements coupled with electro-thermal models. Highlights: Experimental challenge to implement direct junction temperature measurements in a railway traction converter using 6500 V IGBT modules is discussed A temperature map based on 32 IGBT chip junction temperature measurements provides an insight view of the converter under operation. Measured temperatures are consistent with calculated temperature. Accuracy of the method is discussed. Obtained temperature distribution is the basis to study temperature evolution when IGBT modules are aging. This experimental set-up is key to evaluate and validate new approaches of condition based and health monitoring.