Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation. (September 2018)

• Record Type: Journal Article
• Authors: Schaffus, T.; Albert, P.; Breuer, W.; Debie, D.; Graml, M.; Hollerith, C.; Kroninger, F.; Mack, W.; Pfaff, H.; Schaffus, M.; Walter, J.
• Is Part Of: Microelectronics and reliability. Volume 88/90(2018)
• Page Start: 299
• Page End: 303
• Publication Date: 2018-09
• Subjects: Raman spectroscopy -- Piezo resistive read out -- Intrinsic stress; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2018.07.093
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electronic components. Micro milling - and laser-decapsulation in combination with plasma etching were chosen as preparation methods. Raman spectroscopy has been applied as well as the piezo resistive read out on a specifically designed model stress monitoring chip. The results of the analysis at each manufacturing step of the model chip and the first investigations of partial decapsulation are presented. Highlights: Intrinsic stresses measured with Raman spectroscopy and piezo resistive read out Influence of Sample Preparation (FIB and mechanical grinding) on intrinsic stress Influence of manufacturing on intrinsic stress Influence of partial decapsulation (Laser decapsulation and micro milling)