A power cycling degradation inspector of power semiconductor devices. (September 2018)

• Record Type: Journal Article
• Authors: Watanabe, A.; Omura, I.
• Is Part Of: Microelectronics and reliability. Volume 88/90(2018)
• Page Start: 458
• Page End: 461
• Publication Date: 2018-09
• Subjects: Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2018.06.071
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: We have proposed a failure analysis based on a real-time monitoring of power devices under acceleration test. The real-time monitoring enables to visualize the mechanism that leads to a failure by obtaining the change of structure inside the device in time domain with high spatial resolution. In this paper, we presented a new analytical instrument based on the proposed failure analysis concept. The essential functions of this instrument are (1) power stress control, (2) non-destructive inspection and (3) water circulation. An original design power-stress control system and a customized scanning acoustic microscopy system enable us a non-destructive inspection inside the device under power cycling test. This instrument exhibits a great advantage especially to monitor failure mechanisms without having to open the module. Highlights: A failure analysis based on real-time monitoring of power devices under acceleration test Present a new analytical instrument based on the proposed failure analysis concept Combining an original design power-stress control system and a customized SAM system