Double tricrystal nucleation behavior in Pb-free BGA solder joints. (July 2019)
- Record Type:
- Journal Article
- Title:
- Double tricrystal nucleation behavior in Pb-free BGA solder joints. (July 2019)
- Main Title:
- Double tricrystal nucleation behavior in Pb-free BGA solder joints
- Authors:
- Han, Jing
Guo, Fu - Abstract:
- Abstract: The orientations of tin grains in a solder joint have a significant influence on its inhomogeneous deformation behavior under thermomechanical fatigue (TMF). In this paper, the tin orientations in as-solidified BGA joints were observed in detail by electron backscattering diffraction (EBSD). Double twinning of tin in the process of solidification was observed in the Sn-based solder joints. Although the morphologies of these twinned microstructures differed (beachball or intertwined), four orientations of tin grains, with each twin grain sharing a corporate [100] or [010] axis, were observed and analyzed in these systems. The results showed that the difference in orientation between the two groups of double tricrystals was in the range of 80° to 90°. The accurate misorientations were calculated to be 79.1°, 82.9° and 86.5°, corresponding to 57.2° and 62.8°. In a joint comprising 9 grains, there were 3 groups of double tricrystals. A joint comprising two grains, involving 55–65° tricrystal misorientations and a corporate [100] rotation axis, was practically a tricrystal. The joints exhibiting 4–9 grains with misorientations close to 60° (with a [100] or [010] axis) and 85° were composed of 1–3 groups of double tricrystals. Highlights: Double twinning of tin during solidification from the melt was observed. Four orientations with the same twin grain were found in double twinning system. The two groups of double twined orientations is in the range of 80° to 90°. For aAbstract: The orientations of tin grains in a solder joint have a significant influence on its inhomogeneous deformation behavior under thermomechanical fatigue (TMF). In this paper, the tin orientations in as-solidified BGA joints were observed in detail by electron backscattering diffraction (EBSD). Double twinning of tin in the process of solidification was observed in the Sn-based solder joints. Although the morphologies of these twinned microstructures differed (beachball or intertwined), four orientations of tin grains, with each twin grain sharing a corporate [100] or [010] axis, were observed and analyzed in these systems. The results showed that the difference in orientation between the two groups of double tricrystals was in the range of 80° to 90°. The accurate misorientations were calculated to be 79.1°, 82.9° and 86.5°, corresponding to 57.2° and 62.8°. In a joint comprising 9 grains, there were 3 groups of double tricrystals. A joint comprising two grains, involving 55–65° tricrystal misorientations and a corporate [100] rotation axis, was practically a tricrystal. The joints exhibiting 4–9 grains with misorientations close to 60° (with a [100] or [010] axis) and 85° were composed of 1–3 groups of double tricrystals. Highlights: Double twinning of tin during solidification from the melt was observed. Four orientations with the same twin grain were found in double twinning system. The two groups of double twined orientations is in the range of 80° to 90°. For a joint comprised of 9 grains, there were 3 groups of double tricrystals. Joints presenting 4–9 grains were composed of 1–3 groups of double tricrystals. … (more)
- Is Part Of:
- Microelectronics and reliability. Volume 98(2019)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 98(2019)
- Issue Display:
- Volume 98, Issue 2019 (2019)
- Year:
- 2019
- Volume:
- 98
- Issue:
- 2019
- Issue Sort Value:
- 2019-0098-2019-0000
- Page Start:
- 1
- Page End:
- 9
- Publication Date:
- 2019-07
- Subjects:
- Grain orientation -- As-solidified joints -- Electron backscattering diffraction (EBSD) -- Double tricrystals
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2019.04.021 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 10922.xml