Cite
APA Citation
Kim, M. S., Pulugurtha, M. R., Kim, Y., Park, G., Cho, K., Smet, V., Sundaram, V., Kim, J., & Tummala, R. (2018). miniaturized and high-performance RF packages with ultra-thin glass substrates. Microelectronics journal, 77, 66–72. http://access.bl.uk/ark:/81055/vdc_100066063082.0x00005b