Cite
HARVARD Citation
Rogié, B. et al. (2018). Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectronics and reliability. pp. 222-231. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Rogié, B. et al. (2018). Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectronics and reliability. pp. 222-231. [Online].