Cite
MLA Citation
Karel Kopejtko and Jindřich Vilím. “An Alternative Way of Making Bumps for Tape Automated Bonding.” Electrocomponent science and technology, vol. 6, 1979, pp. 185–187. http://access.bl.uk/ark:/81055/vdc_100082143304.0x00005e
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Karel Kopejtko and Jindřich Vilím. “An Alternative Way of Making Bumps for Tape Automated Bonding.” Electrocomponent science and technology, vol. 6, 1979, pp. 185–187. http://access.bl.uk/ark:/81055/vdc_100082143304.0x00005e