Remarks on Wire and Die Bonding for Hybrid Circuits. (1977)

• Record Type: Journal Article
• Authors: Soffa, A.
• Is Part Of: Electrocomponent science and technology. Volume 4:Number 3/4(1977)
• Page Start: 157
• Page End: 161
• Publication Date: 1977
• Subjects: Electronics -- Periodicals; Electronic circuits -- Periodicals; 621.3815
• DOI: 10.1155/APEC.4.157
• Languages: English
• ISSNs: 0305-3091

Abstract

Abstract : Advances in hybrid automatic wire bonding include refined joy stick techniques, automatic alignment, a digitally operated head for higher speeds and flexibility, missing ball detection and programming aids. Advanced hybrid die attach equipment will have to accept a large variety of chip presentation techniques but will use CCTV and automatic alignment with microprocessor controls to aid programming and speed output.