Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques. (June 2019)

• Record Type: Journal Article
• Authors: Chen, Xiaomei; Shaw, Christopher; Gelman, Len; Grattan, Kenneth T.V.
• Is Part Of: Measurement. Volume 139(2019)
• Page Start: 387
• Page End: 402
• Publication Date: 2019-06
• Subjects: Interface adhesion -- Bond strength -- Coating-substrate system -- Minimum-destructive testing; Weights and measures -- Periodicals; Measurement -- Periodicals; Measurement; Weights and measures; Periodicals; 530.8
• DOI: 10.1016/j.measurement.2019.03.026
• Languages: English
• ISSNs: 0263-2241

Abstract

Abstract: In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.