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HARVARD Citation
Li, X. et al. (n.d.). Mass copper micro-embossing by tungsten die for MEMS applications. Journal of micromechanics and microengineering. p. . [Online].
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Li, X. et al. (n.d.). Mass copper micro-embossing by tungsten die for MEMS applications. Journal of micromechanics and microengineering. p. . [Online].