Mass copper micro-embossing by tungsten die for MEMS applications. (9th October 2018)

• Record Type: Journal Article
• Authors: Li, Xuanyang; Liu, Jian; Xu, Jie; Wang, Zetian; Chen, Jing
• Is Part Of: Journal of micromechanics and microengineering. Volume 28:Number 11(2018:Nov.)
• Publication Date: 2018-10-09
• Subjects: micro-embossing -- tungsten -- copper -- microchannels; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/1361-6439/aae2c0
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: The copper micro-embossing process using tungsten die was investigated in this paper, which can be applied for mass production on micro-electro-mechanical system (MEMS) components. Tungsten die fabricated by inductively coupled plasma etching was applied, because of its high mechanical strength and high accuracy. Both cold and hot micro-embossing were performed. Micro damage of both copper and tungsten was observed in cold micro-embossing, as the pressing force reached up to 10 kN. Hot micro-embossing under 473 K with a pressing force of 6 kN showed fewer micro-defects without damage. The microchannels with smaller space ratios and channel widths had better filling performances, due to their capability against friction or upsetting. The patterns were fully transferred from the tungsten die to copper workpiece with a minimum linewidth of 20 µ m and aspect ratio of up to 1.09. The fabrication method shows the potential for copper MEMS component fabrication in mass production at low-cost.