Cite
MLA Citation
R. Alberti et al.. “Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism.” Microelectronics and reliability, vol. 55, no. 9, 2015, pp. 1838–1842. http://access.bl.uk/ark:/81055/vdc_100051211279.0x000064