Cite
HARVARD Citation
Alberti, R. et al. (2015). Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. Microelectronics and reliability. 55 (9), pp. 1838-1842. [Online].
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Alberti, R. et al. (2015). Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. Microelectronics and reliability. 55 (9), pp. 1838-1842. [Online].