3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018). Issue 8 (23rd April 2018)

Record Type:: Journal Article
Title:: 3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018). Issue 8 (23rd April 2018)
Main Title:: 3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018)
Authors:: Farraj, Yousef
Layani, Michael
Yaverboim, Avi
Magdassi, Shlomo
Abstract:: Abstract : Printed electrical circuit with conductivity higher than 70% of bulk copper is obtained. Self‐reducible copper complex ink is used as a catalyst for electroless copper plating. The ink is printed on 2D and 3D substrates followed by short plasma treatment to induce its decomposition and render it catalytically active. This is reported by Shlomo Magdassi and co‐workers in article number1701285 .
Is Part Of:: Advanced materials interfaces. Volume 5:Issue 8(2018)
Journal:: Advanced materials interfaces
Issue:: Volume 5:Issue 8(2018)
Issue Display:: Volume 5, Issue 8 (2018)
Year:: 2018
Volume:: 5
Issue:: 8
Issue Sort Value:: 2018-0005-0008-0000
Page Start:: n/a
Page End:: n/a
Publication Date:: 2018-04-23
Subjects:: 3D printings -- conductive -- copper complex inks -- electroless plating -- heat‐sensitive substrates
Materials science -- Periodicals
620.11
Journal URLs:: http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)2196-7350 ↗
http://onlinelibrary.wiley.com/ ↗
DOI:: 10.1002/admi.201870038 ↗
Languages:: English
ISSNs:: 2196-7350
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
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Ingest File:: 9128.xml