3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018). Issue 8 (23rd April 2018) - Farraj, Yousef
Abstract : Printed electrical circuit with conductivity higher than 70% of bulk copper is obtained. Self‐reducible copper complex ink is used as a catalyst for electroless copper plating. The ink is printed on 2D and 3D substrates followed by short plasma treatment to induce its decomposition and render it catalytically active. This is reported by Shlomo Magdassi and co‐workers in article number1701285 .