Erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 J. Micromech. Microeng. 26105007). (11th April 2017) - Aono, T; Suzuki, K; Kanamaru, M; Okada, R; Maeda, D; Hayashi, M; Isono, Y