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APA Citation
Zhang, L., Wu, Z., Xu, X., Xu, H., Wu, Y., Li, P., & Yang, P. (2010). approach on thermoelectricity reliability of board-level backplane based on the orthogonal experiment design. International journal of materials and structural integrity, 4, 170–185. http://access.bl.uk/ark:/81055/vdc_100073984086.0x000015